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Chips, memory, networking and power. Newest first.
After HBM: where the next AI bottleneck is forming
Memory was the squeeze of 2026. The constraint is already moving outward from the chip: to packaging, optics, storage and power. Here's the order, the numbers, and what could break it.
What is HBM memory, and why does AI need so much of it?
High-bandwidth memory is the stacked DRAM sitting next to every AI accelerator. Here's how it works, who makes it, and why it's squeezing the entire memory market.
The AI supercycle is moving down the stack
Spending is still accelerating, but the pricing power is shifting from chips to the bottlenecks: memory and power. Here are the numbers, the thesis, and what could break it.
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What this site covers, how each post is built, and why every thesis comes with its risks.
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